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第十七届电子封装国际会议免费论坛信息

分类:院内新闻 作者:hpj 来源: 时间:2016-08-15 访问量:

会议地点:武汉光谷金盾大酒店(武汉市洪山区吴家湾特1号邮科院对面)

免费论坛时间:201681613:30– 1600

免费论坛信息如下:

OVERVIEW OF WIDE BANDGAP SEMICONDUCTOR FORUM

房间E(3楼晴川厅)

Time

Organizer/Speaker

14:00–14:05

Opening

Prof. Sheng Liu

Wuhan University, China

14:05– 16:00

Prof. Shuji Nakamura

University of California at Santa Barbara, USA

Prof. Yue Hao

Xidian University, China

Atsushi Okuno

Green Planets CO., LTD., Japan

Dr. Guoyou Liu

CRRCCO., LTD., China

Prof. Kuang Sheng

Zhejiang University, China

Prof. Zhihong Feng

The 13th Research Institute of China Electronics Technology Group Corporation, China

Prof. Hongxing Wang

Xi'an Jiaotong University, China

Forum Discussions

OVERVIEW OF HETEROGENEOUS INTEGRATION ROADMAP (HIR) FORUM

房间F3楼琴台厅)

Time

Topic

Speaker

13:30–14:00

Registration

14:00–14:10

Opening

Prof. Xuejun Fan

Lamar Univeristy, USA

14:10– 14:35

Heterogeneous Integration for IoT Cloud and Smart Things -- A Roadmap for the Future

Dr.William Chen

ASE Group, USA

14:35– 15:00

Introduction on the IEEE "International Technology Roadmap of Wide Bandgap Semiconductors" (ITRW)

Prof.Guoqi Zhang

Delft University of Technology, the Netherlands

15:00–15:30

Heterogeneous Integration of LED, Driver, Control Circuitry, and Passives for iLighting: A SiP Approach

Prof. Ricky Lee

Hong Kong University of Science and Technology, Hong Kong