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主讲人：Kyung W. Paik教授

题目：Anisotropic Conductive Films (ACFs) Interconnection Technology for Wearable Electronics Applications

地点：武汉大学新普京澳门娱乐场app网站学术报告厅（新9教三楼）

时间：2016年6月24 日 （周五）15:00

举办单位：武汉大学新普京澳门娱乐场app网站

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摘要：

Due to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile electronic products, there have been growing needs of wearable electronic products in near future.

To realize wearable electronic products, there should be five core electronic hardware technologies - (1) flexible semiconductor, (2)flexible sensors, (3)flexible display, (4) flexible battery and (5) flexible packaging & interconnection technologies. In the flexible semiconductor devices, ICs are thinned down to nanometer thickness, and then transferred to a polymer film. For the flexible sensors, various types of sensors have been introduced using flexible substrates such as FPCs (flexible printed circuits) and conductive fabrics. In contrast, flexible displays are already available by introducing OLED (organic LED) realized on polymer base films. And flexible batteries are also demonstrated by adapting solid electrolytes. However, there has been little development on flexible packaging & interconnection areas.

As one of the promising flexible packaging and interconnection technologies, FPCs and conductive fabric substrates and ACF materials-based packaging and interconnection method will provide the flexible interconnect solution for realizing wearable electronic products.

In the electronic packaging technology for wearable electronics, first, flexible IC packaging structures such as COF(Chip On Flex)/CIF(Chip In Flex) can provide an immediate technical solution for semiconductor IC package flexibility for wearable electronics. Second, FOF(Flex On Flex) and FOF(Flex On Fabric) technologies using FPCs and conductive fabric substrates and ACFs interconnection materials become very important, because ACF interconnection provides excellent electrical flexibility compared with conventional solder- or socket-based interconnection methods which have a limitation of bending and flexing.

In this presentation, it will be presented how the ACFs technology can be successfully used for the COF/CIF chip packaging and FOF interconnection and assembly methods with proven flexibility for wearable electronics applications.

报告人简介：

Kyung W. Paik received the Ph.D. degree from the Cornell University at the department of Materials Science and Engineering in 1989.

After the Ph.D. degree, he worked at the General Electric Corporate Research and Development from 1989 to 1995, where he was involved with the R & D of materials and processes of GE High Density Interconnect (HDI) multichip module technology and power I/C packaging as a Senior Technical Staff. And then, he joined the Korea Advanced Institute of Science and Technology (KAIST) as a professor at the department of Materials Science and Engineering in 1995, and served as the VP of Research during 2011 ~ 2013. In his Nano-Packaging and Interconnect Laboratory (NPIL), he has been working in the areas of Anisotropic Conductive Adhesives(ACAs) materials and processing, 3-D TSV NCF interconnect materials, wearable electronics interconnection technology, and display packaging technologies, and has published more than 160 SCI journal papers and has more than 40 issued and pending US patents.